| FEATURE | CAPABILITY |
| Layer Count | 1 layer ~ 4 layers Aluminium & Copper & Iron & Steel-based |
| Product Type | CU / CU Pedestal / CU&AL Composite / AL / Iron / Steel / CU&AL + FPC-based |
| Surface Treatment | OSP ; LF-HASL ; Immersion Silver ; ENIG ; ENEPIG |
| Thermal Conductivity | 1.0 W/mK ; 2.0 W/mK ; 4.0 W/mK ; 8.0 W/mK ; 12.0 W/mK ; 290 W/mK ; 400 W/mK |
| Copper Thickness | 0.5 ~ 10 oz |
| Max. Finished Board Size | 1200 mm x 500 mm (Aluminium) 600 mm x 500 mm (Copper) |
| Min. Board Thickness | 0.40 mm ± 0.10 mm |
| Max. Board Thickness | 4.0 mm ± 0.25 mm |
| Min. Spacing | 4 mil / 0.1 mm |
| Min. Trace | 3 mil / 0.08 mm |
| Min. Hole Size | 31.5 mil / 0.8 mm |
| Pedestal | Yes |
| Blind Slot | Yes |
| Insulation Hole | Yes |
| Blind vias Plating | Yes |
| Flex + Single Copper | Yes |
| 2D Laser Barcode | Yes |