Metal Core PCB – Tech Spec

FEATURECAPABILITY
Layer Count1 layer ~ 4 layers
Aluminium & Copper & Iron & Steel-based
Product TypeCU / CU Pedestal / CU&AL Composite / AL / Iron / Steel / CU&AL + FPC-based
Surface TreatmentOSP ; LF-HASL ; Immersion Silver ; ENIG ; ENEPIG
Thermal Conductivity1.0 W/mK ; 2.0 W/mK ; 3.0 W/mK ; 4.0 W/mK ; 8.0 W/mK ; 12.0 W/mK ; 290 W/mK ; 400 W/mK
Copper Thickness0.5 ~ 10 oz
Max. Finished Board Size1200 mm x 500 mm (Aluminium)
600 mm x 500 mm (Copper)
Min. Board Thickness0.40 mm ± 0.10 mm
Max. Board Thickness4.0 mm ± 0.25 mm
Min. Spacing6 mil / 0.15 mm
Min. Trace6 mil / 0.15 mm
Min. Hole Size31.5 mil / 0.8 mm
PedestalYes
Blind SlotYes
Insulation HoleYes
Blind vias PlatingYes
Flex + Single CopperYes
2D Laser BarcodeYes