Flex / Rigid-Flex PCB
Technical Specifications
Sample Portfolio
Technical Specifications
| FEATURE | CAPABILITY |
| Layer Count | 1 layer ~ 12 layers (Rigid + Flex) |
| Max. Finished Board Size | 250 mm x 850 mm |
| Copper Thickness | 0.5 oz ~ 7.0 oz |
| Min. (Flex) Board Thickness | 0.07 mm ± 0.03 mm |
| Max. (Flex) Board Thickness | 3.00 mm ± 0.25 mm |
| Min. Trace | 2 mil / 0.05 mm (⅓ oz) |
| Min. Spacing | 2 mil / 0.05 mm (⅓ oz) |
| Min. Hole Size | 4 mil / 0.10 mm |
| Aspect Ratio | 8:1 |
| Impedance Control | 50 ohm ±8% |
| HDI Construction | Yes |
| Rigid and Flexible | Yes |
| Hollow Board | Yes |
| Separated Layer Board | Yes |
Sample Portfolio
1 Layer with Stiffener and Gold Finger 7oz Copper Thickness 
3 Layers Rigid-Flex 
6 Layers Plug VIA Rigid-Flex 
8 Layers Rigid Flex 
Rigid Flex with Gold Finger 
8 Layers Rigid-Flex with Gold Finger 
Rigid Flex with BGA 
Inner & Outer Layer Impedance Control
