Rigid PCB
Technical Specifications
Sample Portfolio
Technical Specifications
| FEATURE | CAPABILITY |
| Layer Count | 1 layer ~ 12 layers |
| Max. Finished Board Size | 500 mm x 700 mm |
| Copper Thickness | 0.5 oz ~ 5.0 oz |
| Min. Board Thickness | 16 mil / 0.40 mm |
| Max. Board Thickness | 200 mil / 5.00 mm |
| Min. Spacing | 3 mil / 0.076 mm |
| Min. Trace | 3 mil / 0.076 mm |
| Min. Hole Size | 3 mil / 0.076 mm |
| Min. Thickness of Thin Core | 4 mil / 0.10 mm |
| Aspect Ratio | 8:1 |
| Impedance Control | 50 ohm ±8% |
| HDI Construction | Yes |
| Carbon Ink | Yes |
| Resin Plugged Via | Yes |
| Peelable Mask | Yes |
| Fill in Hole Plating | Yes |
Sample Portfolio
4 Layers Immersion Gold 
8 Layers HDI with BGA and VIA filled copper plating 
Gold Finger 
12 Layers BGA 
Black Soldermask with HAL 
Blue Soldermask with OSP 
Red Soldermask with Plug Hole 
White Soldermask with Plug Hole
