Metal Core PCB
Technical Specifications
Sample Portfolio
Technical Specifications
FEATURE | CAPABILITY |
Layer Count | 1 layer ~ 4 layers Aluminium & Copper & Iron & Steel-based |
Product Type | CU / CU Pedestal / CU&AL Composite / AL / Iron / Steel / CU&AL + FPC-based |
Surface Treatment | OSP ; LF-HASL ; Immersion Silver ; ENIG ; ENEPIG |
Thermal Conductivity | 1.0 W/mK ; 2.0 W/mK ; 4.0 W/mK ; 8.0 W/mK ; 12.0 W/mK ; 290 W/mK ; 400 W/mK |
Copper Thickness | 0.5 ~ 10 oz |
Max. Finished Board Size | 1200 mm x 500 mm (Aluminium) 600 mm x 500 mm (Copper) |
Min. Board Thickness | 0.40 mm ± 0.10 mm |
Max. Board Thickness | 4.0 mm ± 0.25 mm |
Min. Spacing | 4 mil / 0.1 mm |
Min. Trace | 3 mil / 0.08 mm |
Min. Hole Size | 31.5 mil / 0.8 mm |
Pedestal | Yes |
Blind Slot | Yes |
Insulation Hole | Yes |
Blind vias Plating | Yes |
Flex + Single Copper | Yes |
2D Laser Barcode | Yes |
Sample Portfolio