| FEATURE | CAPABILITY |
| Layer Count | 1 layer ~ 20 layers |
| Max. Finished Board Size | 500 mm x 700 mm |
| Copper Thickness | 0.5 oz ~ 5.0 oz |
| Min. Board Thickness | 12 mil / 0.30 mm |
| Max. Board Thickness | 200 mil / 5.00 mm |
| Min. Spacing | 3 mil / 0.076 mm |
| Min. Trace | 3 mil / 0.076 mm |
| Min. Hole Size | 3 mil / 0.076 mm |
| Min. Thickness of Thin Core | 4 mil / 0.10 mm |
| Aspect Ratio | 8:1 |
| Impedance Control | 50 ohm ±8% |
| HDI Construction | Yes |
| Carbon Ink | Yes |
| Resin Plugged Via | Yes |
| Peelable Mask | Yes |
| Fill in Hole Plating | Yes |