Rigid PCB – Tech Spec

FEATURECAPABILITY
Layer Count1 layer ~ 20 layers
Max. Finished Board Size500 mm x 700 mm
Copper Thickness0.5 oz ~ 5.0 oz
Min. Board Thickness12 mil / 0.30 mm
Max. Board Thickness200 mil / 5.00 mm
Min. Spacing3 mil / 0.076 mm
Min. Trace3 mil / 0.076 mm
Min. Hole Size3 mil / 0.076 mm
Min. Thickness of Thin Core4 mil / 0.10 mm
Aspect Ratio8:1
Impedance Control50 ohm ±8%
HDI ConstructionYes
Carbon InkYes
Resin Plugged ViaYes
Peelable MaskYes
Fill in Hole PlatingYes